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| Home » Fluxes » No Clean » NP 302 F |
 NP-302 F No-Clean Flux ( Resin Free Liquid No-Clean Flux ) |
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| NP-302 F is No-Clean Flux specially formulated and developed for surface mount devices and high density plated through hole assembly soldering for electronics and telecommunication applications. 302 F No-Clean Flux has been specifically formulated for foam application. It can also be applied on PCBs by spraying, wave or dipping application.NP-302 F is clear liquid, organic flux in a multicomponent vehicle. Flux has extremely low solid content and exhibits excellent fluxing action. Eliminates post solder cleaning, reduces costs and eliminates use of CFC. Flux is halide free. Flux has excellent foaming properties. Flux leaves negligible post solder residue.
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