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| Home » Fluxes » Rosin Base » NP 215F |
 NP-215 F SOLDERING FLUX ( Liquid Activated Resin Flux ) |
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| NP-215 F has excellent foaming properties and can be applied on PCBs by wave of foam, brushing or spraying. The flux is specially formulated to get the best quality of soldered joints. Flux facilitates excellent flow and spreading of molten solder without any sign of spattering and complies with US specification MIL-F-14256. Flux has minimum corrosion and ensures excellent reliability and longer life of soldered joints and thereby the equipment. Flux residues are dry and free from tackiness immediately after soldering, thus considerably increasing production speed. Flux eliminates pin holes on the soldered joint. Flux is compatible with NP solderable lacquer. Flux density should be maintained using compatible Solvent NP-510. |
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