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| Home » SMT Solder Paste » No Clean Solder Pastes |
 No Clean Type Solder Pastes |
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1. Part No.: G4A MB 900 SERIES
Composition: Sn-62, Pb-36, Ag-2
2. Part No.: G4 MB 900 SERIES
Composition: Sn-62, Pb-38
We are representing M/s. Union Soltek, Taiwan who are known for their best quality. This RMA type solder paste which consists high thixotropic flux and spherical solder powder with little oxide and uniform particle size distribution aimed for improvement of printing property as well. The positive features of this SMT paste is as under:
- No clean-RMA type, copper mirrors and silver chromate tests passed.
- Excellent for continuous printing, solder balls are not formed after continuous printing.
- Fine pitch (0.5mm/20mil)(0.4mm/16mil)
- Excellent shelf life with minimum change of viscosity.
- It hardly slumps, bridging of solder is not recognized after reflow.
- Superior solders wettability at soldering, and solder residue is non-corrosive after soldering.
- Solder balls are not formed at reflow.
- Extremely reliable solder joints.
- Low flux content.
- It has an excellent shelf life and can be stored in room temp. (25 Deg. C).
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