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| Home » SMT & BGA Solder Paste » Pb Free Solder Pastes » LF 5C 300 |
 LF-5C-300 |
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Part No.: LF-5C-300
Composition: Sn-96.5, Ag-3.0, Cu-0.5%
LF-5C-300 is Pb-free solder paste using Pb-free manufactured with the atomized gas and centrifugal sparing methods, powder is fine, processes a truly spherical shape, less oxidation and mixed with high technical flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing.
Features:
- Pb-free (Sn/Ag/Cu series) solder alloy is used.
- Stable printability is obtained with little change in viscosity during continuous printing.
- Excellent printability with fine patterns can be obtained.
- Having a good solderability, adequate wettability is shown on various parts.
- Can be used in air-reflow and N2 reflow processes.
- Excellent solderability can be attained for a high peak temperature.
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